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Premium Compact Liquid Glue Remover for Mobile Motherboard & IC Cleaning

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2.00JD

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Detail Description

  1. Liquid Glue Remover: Professional cleaning solution designed for adhesive removal during smartphone motherboard, IC, and electronics repair.
  2. Fast-Acting Formula: Helps soften stubborn adhesive residues to make subsequent cleaning and scraping easier.
  3. Black Glue Removal: Suitable for loosening black adhesive and underfill residue surrounding ICs during advanced board-level repair.
  4. OCA Residue Cleaning: Helps remove OCA adhesive residue during screen refurbishment and precision electronics servicing.
  5. UV Mask Cleaning: Can be used for controlled removal and cleaning of compatible UV mask residues during PCB repair.
  6. IC Reballing Preparation: Useful for preparing chip and motherboard surfaces before IC reballing and component-level repair.
  7. Precision PCB Cleaning: Designed for detailed work around motherboard circuits, copper traces, IC areas, and other sensitive repair zones.
  8. Controlled Electronics Use: Formulated for professional repair applications where careful adhesive removal around delicate components is required.
  9. Compact Bottle Design: Small, space-saving bottle is convenient for daily technician use and helps keep the repair bench organized.
  10. Professional Repair Application: Suitable for motherboard degumming, IC cleaning, underfill removal, OCA residue cleaning, BGA preparation, and advanced mobile repair.


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Premium Compact Liquid Glue Remover for Mobile Motherboard & IC Cleaning
2.00JD 0.00JD
2.00JD
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