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Physical Product

MECHANIC XG-50 Solder Paste

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4.00JD

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  4.00JD

Detail Description

  1. Professional Solder Paste: High-performance liquid solder paste designed for precision smartphone motherboard and electronics repair.
  2. 183°C Melting Point: Standard 183°C melting profile supports controlled soldering, Reflow, and Reballing procedures.
  3. CPU Reballing Support: Suitable for detailed CPU Reballing and processor-level motherboard repair.
  4. IC Soldering: Designed for IC replacement, soldering, and component-level servicing on compatible PCBs.
  5. SMD & BGA Maintenance: Suitable for Micro-SMD work, BGA Reballing, and high-density component repair.
  6. Consistent Alloy Texture: Homogeneous paste consistency supports smooth spreading and accurate application during stencil-based work.
  7. Stencil Application: Designed to distribute evenly through compatible Reballing stencils without excessive clumping.
  8. Reduced Solder Bridging: Controlled paste behavior helps reduce unwanted solder bridges when applied and heated correctly.
  9. Reduced Solder Ball Formation: Proper application helps minimize unwanted solder-ball scattering during controlled heating.
  10. Reliable Solder Joints: Supports bright, consistent, and electrically conductive solder joints for precision electronics repair.


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MECHANIC XG-50 Solder Paste
4.00JD 0.00JD
4.00JD
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