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MECHANIC UFO-06 High-End 0.12mm BGA Steel Reballing Stencil for iPhone XS/XS Max/XR

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Detail Description

  1. BGA Reballing Stencil: Professional steel stencil designed for chip-level repair and IC Reballing on compatible iPhone XS, iPhone XS Max, and iPhone XR Logic Boards.
  2. 0.12mm Precision Thickness: Calibrated 0.12mm thickness supports controlled Solder Paste application and accurate BGA Reballing workflows.
  3. Heat-Resistant Steel: Manufactured from high-grade steel designed to maintain stability during controlled soldering and Hot Air Rework.
  4. Anti-Deformation Structure: Reinforced construction helps reduce stencil bending, bulging, and warping during repeated thermal procedures.
  5. Precision Laser-Cut Apertures: Fine micro-apertures support accurate alignment with compatible IC Pads and BGA layouts.
  6. Consistent Solder Paste Distribution: Calibrated openings help distribute Solder Paste evenly for controlled solder-ball formation.
  7. Clean Paste Release: Precision aperture design supports cleaner Solder Paste release during Reballing and Reflow procedures.
  8. Reduced Solder Bridging: Accurate stencil geometry and controlled paste application help reduce unwanted Solder Bridging when used correctly.
  9. Missing Pad Repair Support: Suitable for compatible Micro-Soldering workflows involving damaged or missing Pad arrays on Logic Boards.
  10. Professional Microscope Repair: Ideal for IC Reballing, BGA repair, Solder Paste application, Pad restoration support, and precision iPhone motherboard servicing.


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MECHANIC UFO-06 High-End 0.12mm BGA Steel Reballing Stencil for iPhone XS/XS Max/XR
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