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Physical Product

MECHANIC S24-01 BGA Steel Reballing Stencil 0.12mm for iPhone 5G/5S

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3.00JD

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  3.00JD

Detail Description

  1. BGA Reballing Stencil: Professional steel stencil designed for IC Reballing and chip-level motherboard repair on compatible iPhone 5G and iPhone 5S Logic Boards.
  2. 0.12mm Precision Thickness: Calibrated 0.12mm thickness supports controlled Solder Paste application and accurate BGA Reballing workflows.
  3. Heat-Resistant Steel: Manufactured from high-grade steel designed to maintain stability during controlled soldering and Hot Air Rework procedures.
  4. Anti-Deformation Structure: Reinforced construction helps reduce stencil warping or distortion during repeated thermal use.
  5. Laser-Cut Precision: Fine laser-cut openings support accurate alignment with compatible IC Pads and BGA layouts.
  6. Micro-Square Apertures: Square opening geometry supports consistent Solder Paste release across dense component patterns.
  7. Chamfered Edge Design: Refined aperture edges help improve paste release and reduce unwanted residue around stencil openings.
  8. Reduced Bridging Risk: Accurate alignment and controlled paste distribution help reduce Solder Bridging during Reballing when used correctly.
  9. Missing Pad Repair Support: Suitable for compatible micro-repair workflows involving damaged or missing Pad areas under microscope inspection.
  10. Professional Micro-Soldering: Ideal for IC Reballing, Solder Paste application, BGA repair, Pad restoration support, and legacy iPhone Logic Board servicing.


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MECHANIC S24-01 BGA Steel Reballing Stencil 0.12mm for iPhone 5G/5S
3.00JD 0.00JD
3.00JD
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