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Physical Product

MECHANIC R350 Desoldering Solder Wick BGA Pad Cleaning Braid

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2.00JD

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  2.00JD

Detail Description

  1. Professional Desoldering Wick: Designed for efficient solder removal, BGA pad cleaning, and precision smartphone PCB repair.
  2. Oxygen-Free Copper Braid: Made from high-purity oxygen-free copper wires woven into a dense structure for effective solder absorption.
  3. Pre-Coated No-Clean Flux: Treated with a non-corrosive No-Clean flux formula to improve solder flow and desoldering efficiency.
  4. Strong Capillary Absorption: Quickly draws molten solder away from PCB pads when used with a heated soldering iron tip.
  5. BGA Pad Cleaning: Suitable for removing residual solder from BGA pads and preparing clean surfaces for reballing and component replacement.
  6. Uniform Heat Transfer: Copper braid helps distribute heat evenly across the working area during solder removal.
  7. PCB Trace Protection: Designed to reduce the risk of damaging or lifting delicate copper traces when used correctly.
  8. Anti-Static Protective Reel: Supplied in a protective dispenser reel for controlled, organized, and anti-tangle deployment.
  9. Moisture-Resistant Storage: Protective reel helps reduce exposure to moisture and oxidation during storage.
  10. Lead-Free Repair Applications: Suitable for lead-free soldering environments, micro-soldering, chip-level repair, and professional PCB maintenance.


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MECHANIC R350 Desoldering Solder Wick BGA Pad Cleaning Braid
2.00JD 0.00JD
2.00JD
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