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MECHANIC NO.226 iPhone CPU & BGA Special High-Activity Flux Paste 10CC

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4.00JD

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  4.00JD

Detail Description

  1. High-Activity Flux Paste: Professional flux formulated for advanced iPhone CPU rework, BGA Reballing, and high-density logic board repair.
  2. 10CC Precision Syringe: Supplied in a 10CC syringe for controlled application on CPU, BGA, IC, and densely arranged solder pads.
  3. iPhone CPU Rework: Specifically suited for processor removal, preparation, positioning, and reflow procedures during compatible iPhone logic board repair.
  4. BGA Reballing Support: Helps promote consistent solder flow during BGA Reballing and component replacement procedures.
  5. Oxide Removal Support: Active flux formulation assists with removing surface oxidation from compatible soldering areas to improve solder wetting.
  6. Enhanced Thermal Wetting: Supports smooth solder alloy distribution across tightly spaced pads during controlled reflow.
  7. Reduced Solder Bridging: Proper application helps reduce unwanted solder bridges across closely spaced BGA pads and pin arrays.
  8. Stable Viscosity: Consistent paste texture helps keep small components positioned during precision soldering and reflow.
  9. Microscope Repair Application: Designed for detailed work on miniature components and high-density logic board layouts under magnification.
  10. Professional Micro-Soldering Use: Ideal for CPU servicing, IC replacement, BGA work, logic board repair, Jump Wire workflows, and precision smartphone maintenance.


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MECHANIC NO.226 iPhone CPU & BGA Special High-Activity Flux Paste 10CC
4.00JD 0.00JD
4.00JD
4