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Physical Product

MECHANIC MS83 Solder Paste (50g / 183°C)

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4.00JD

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Detail Description

  1. Professional Solder Paste: High-performance liquid solder paste designed for precision smartphone hardware and electronics repair.
  2. 50g Professional Package: Supplied in a 50g container suitable for repeated IC, CPU, BGA, SMD, and Micro-Soldering work.
  3. 183°C Melting Point: Standard 183°C melting profile supports controlled soldering, Reflow, and Reballing procedures.
  4. IC Reballing Support: Suitable for detailed IC Reballing and component-level motherboard repair.
  5. CPU Soldering: Designed for compatible CPU soldering and processor-level servicing on smartphone logic boards.
  6. SMD & BGA Maintenance: Suitable for Micro-SMD work, BGA Reballing, and high-density PCB component repair.
  7. Fine Alloy Texture: Finely atomized alloy formulation supports smooth and even application through compatible stencils.
  8. Reduced Clumping: Consistent paste texture helps minimize uneven buildup during stencil-based Reballing work.
  9. Reduced Solder Bridging: Controlled application helps reduce unwanted bridges between closely spaced pads.
  10. Consistent Solder Joints: Helps produce bright, stable, and electrically conductive solder joints while reducing unwanted solder-ball formation when applied and heated correctly.


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MECHANIC MS83 Solder Paste (50g / 183°C)
4.00JD 0.00JD
4.00JD
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