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MECHANIC Motherboard Chip Degumming Precision Steel Brush

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3.00JD

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  3.00JD

Detail Description

  1. Precision Degumming Brush: Designed for removing stubborn adhesive, black glue, resin, epoxy residue, and underfill during smartphone motherboard repair.
  2. Ultra-Fine Steel Bristles: High-density stainless steel wire bristles provide controlled cleaning around BGA ICs, CPUs, and other board-level components.
  3. Underfill Removal: Helps clear hardened underfill compounds surrounding chips during advanced PCB servicing and component replacement.
  4. Heat-Resistant Bristles: Steel wire construction is designed to withstand elevated temperatures during hot-air-assisted adhesive removal.
  5. Controlled Scraping Action: Provides a balance between cleaning force and precision for detailed work around sensitive motherboard areas.
  6. PCB Surface Protection: Fine bristle design helps reduce the risk of damaging solder mask or delicate copper pads when used carefully.
  7. Anti-Static Design: Designed to support safer cleaning around sensitive ICs and electronic components during repair work.
  8. Ergonomic Anti-Slip Handle: Provides a secure grip and improved control during detailed cleaning and scraping operations.
  9. Microscope Repair Control: Compact precision design provides accurate handling while working under a repair microscope.
  10. Professional PCB Applications: Suitable for BGA work, IC cleaning, chip replacement, underfill removal, motherboard degumming, and micro-soldering workflows.


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MECHANIC Motherboard Chip Degumming Precision Steel Brush
3.00JD 0.00JD
3.00JD
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