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MECHANIC Mid-Level Steel Stencil for iPhone 14 / 14 Pro / 14 Pro Max Reballing

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3.00JD

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Detail Description

  1. Professional Reballing Stencil: Precision steel stencil designed for chip-level motherboard repair and IC Reballing on iPhone 14, iPhone 14 Pro, and iPhone 14 Pro Max.
  2. Multi-Model Compatibility: Combines layouts for supported iPhone 14 series motherboards, making it practical for professional repair workstations.
  3. Stainless Steel Construction: Manufactured from heat-resistant stainless steel for durability during repeated soldering and Reballing procedures.
  4. Anti-Bulging Structure: Reinforced design helps resist deformation and warping during controlled heating and soldering workflows.
  5. Laser-Cut Precision: High-definition laser-cut openings provide accurate positioning for compatible IC and motherboard Pad layouts.
  6. Square Aperture Design: Micro-precise square openings support consistent solder paste placement and controlled solder ball formation.
  7. Smooth Paste Release: Aperture structure helps promote uniform solder paste transfer and easier stencil separation after heating.
  8. Accurate Pad Alignment: Precision grid layout supports close alignment between stencil openings and compatible component Pads during Reballing.
  9. Reduced Solder Bridging: Controlled aperture spacing and paste distribution help reduce the risk of unwanted solder bridges when used correctly.
  10. Professional Micro-Soldering: Suitable for IC Reballing, chip-level repair, motherboard restoration, stencil-based solder paste application, and high-density iPhone Logic Board servicing.

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