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MECHANIC MagTin A8-A16 9-in-1 Maglev IC Planting Reballing Platform

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20.00JD

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  20.00JD

Detail Description

  1. 9-in-1 Reballing Platform: Professional magnetic IC planting and BGA Reballing platform designed for precision Apple processor repair workflows.
  2. Apple A8-A16 Support: Designed for compatible Apple processor generations from A8 through A16 Bionic for a broad range of iPhone CPU repair applications.
  3. Maglev Magnetic System: Magnetic positioning system helps hold compatible steel stencils securely and maintain stable alignment during Reballing.
  4. Automatic Alignment Support: Integrated magnets assist with accurate stencil positioning over compatible CPU Pad matrices.
  5. Stable Stencil Locking: Magnetic fixation helps reduce unwanted stencil and component movement while applying Solder Paste and controlled heat.
  6. Precision CPU Reballing: Supports accurate Solder Paste placement and BGA ball formation for compatible Apple processors.
  7. Reduced Micro-Bridging: Stable alignment and controlled paste application help reduce unwanted Solder Bridging during Reballing when used correctly.
  8. Heat-Resistant Construction: Manufactured from materials designed to maintain stability during controlled Reflow and Hot Air Rework procedures.
  9. Anti-Deformation Design: Rigid platform construction helps reduce unwanted movement and deformation during repeated thermal workflows.
  10. Professional Micro-Soldering: Suitable for CPU Reballing, IC Planting, Missing Pad repair support, Solder Paste application, chip positioning, and advanced Logic Board servicing under a microscope.


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MECHANIC MagTin A8-A16 9-in-1 Maglev IC Planting Reballing Platform
20.00JD 0.00JD
20.00JD
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