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MECHANIC LX5 ULTRA Universal Preheating Platform

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23.00JD

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  23.00JD

Detail Description

  1. Universal Preheating Platform: Professional heating system designed for smartphone PCB layer separation, IC desoldering, Reballing, and advanced Micro-Soldering workflows.
  2. Ceramic Heating Core: High-efficiency ceramic heater supports rapid heat-up and stable thermal performance during precision motherboard repair.
  3. Uniform Heat Distribution: Designed to spread heat consistently across the working surface, helping reduce localized hot spots and concentrated thermal stress.
  4. Multi-Layer PCB Repair: Suitable for controlled heating during separation and servicing of compatible stacked and multi-layer Logic Boards.
  5. HD Digital Color Display: Integrated high-definition display provides real-time temperature monitoring for easier thermal control during repair.
  6. Precision Temperature Control: Responsive controls allow technicians to adjust heating conditions for delicate IC, CPU, PCB, and Reballing procedures.
  7. Modular Repair System: Supports interchangeable modules for different motherboard and chipset repair requirements.
  8. Brass & Magnetic Alignment Stencils: Includes highly conductive brass and magnetic alignment components designed to support accurate positioning across compatible iOS and Android repair layouts.
  9. Heat-Insulated Chassis: Heavy-duty insulated structure helps limit unnecessary heat transfer to surrounding work areas during extended professional use.
  10. Professional Electronics Repair: Ideal for PCB Preheating, Logic Board separation, IC desoldering, CPU servicing, Reballing, and precision smartphone motherboard maintenance.


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MECHANIC LX5 ULTRA Universal Preheating Platform
23.00JD 0.00JD
23.00JD
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