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MECHANIC iTin Max Precision CPU Positioning & Reballing Tin Planting Platform

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25.00JD

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  25.00JD

Detail Description

  1. Precision CPU Reballing Platform: Professional platform designed for CPU positioning, BGA Reballing, Tin Planting, and precision smartphone chipset repair workflows.
  2. Automatic Magnetic Alignment: Integrated magnetic positioning system helps align compatible steel stencils accurately over the processor package.
  3. Stable CPU Positioning: Secure fixture structure helps reduce unwanted processor and stencil movement during Solder Paste application and thermal Rework.
  4. Precision Tin Planting: Supports controlled Solder Paste printing and consistent BGA ball formation on compatible CPU and IC layouts.
  5. High-Density Construction: Built from durable composite materials designed to maintain dimensional stability during controlled thermal repair procedures.
  6. Heat-Resistant Design: Material structure is designed to withstand repeated Reflow and Hot Air Rework while helping limit unwanted thermal deformation.
  7. Ventilation Channel Structure: Integrated ventilation channels support more balanced heat dissipation around the working area during controlled heating.
  8. Reduced Solder Bridging: Accurate stencil positioning and controlled Solder Paste application help reduce unwanted Micro-Bridging during Reballing.
  9. Pad Protection Support: Stable positioning and controlled thermal workflows help reduce excessive mechanical or thermal stress around delicate CPU Pads when used correctly.
  10. Professional Micro-Soldering: Suitable for CPU Reballing, IC positioning, Tin Planting, Missing Pad repair support, Solder Paste application, and advanced Logic Board repair under a microscope.

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MECHANIC iTin Max Precision CPU Positioning & Reballing Tin Planting Platform
25.00JD 0.00JD
25.00JD
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