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MECHANIC iTin 35 High-End BGA Steel Reballing Stencil for Huawei P30 Pro Motherboard

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4.00JD

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Detail Description

  1. Huawei P30 Pro BGA Stencil: Professional steel stencil designed for chip-level repair and BGA Reballing on compatible Huawei P30 Pro motherboards.
  2. Kirin CPU Repair Support: Precision layout is designed around compatible Kirin CPU matrices and surrounding IC Pad arrays for advanced motherboard repair.
  3. Heat-Resistant Steel: Manufactured from high-grade steel designed to maintain structural stability during controlled Reflow and Hot Air Rework.
  4. Anti-Deformation Structure: Reinforced construction helps reduce stencil bending, bulging, and distortion during repeated thermal procedures.
  5. Micro-Square Apertures: Precisely calibrated square openings support accurate alignment with compatible CPU and peripheral IC Pad layouts.
  6. Precision Laser-Cut Design: Fine laser-cut apertures support controlled Solder Paste application and accurate component positioning.
  7. Uniform Solder Paste Distribution: Aperture geometry helps distribute Solder Paste evenly across dense BGA connection arrays.
  8. Reduced Micro-Bridging: Precise alignment and controlled paste application help reduce unwanted Solder Bridging during Reballing when used correctly.
  9. Missing Pad Repair Support: Suitable for compatible Micro-Soldering workflows involving damaged or missing Pad matrices under microscope inspection.
  10. Professional Motherboard Repair: Ideal for CPU Reballing, peripheral IC repair, Solder Paste application, Pad restoration support, and advanced Huawei motherboard servicing.


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MECHANIC iTin 35 High-End BGA Steel Reballing Stencil for Huawei P30 Pro Motherboard
4.00JD 0.00JD
4.00JD
4