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MECHANIC iTin 04 A10 High-End BGA Steel Reballing Stencil for Apple A10 CPU

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4.00JD

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  4.00JD

Detail Description

  1. Apple A10 Fusion CPU Stencil: Professional BGA steel stencil designed for Apple A10 Fusion processor Reballing and chip-level repair on compatible iPhone 7 and iPhone 7 Plus Logic Boards.
  2. A10 Fusion Compatibility: Precision layout is designed around compatible Apple A10 Fusion CPU and associated RAM Pad arrays for advanced motherboard repair workflows.
  3. Heat-Resistant Steel: Manufactured from high-grade steel designed to maintain structural stability during controlled Reflow and Hot Air Rework.
  4. Anti-Deformation Structure: Reinforced construction helps reduce stencil bending, bulging, and distortion during repeated thermal procedures.
  5. Precision Laser-Cut Apertures: Calibrated micro-apertures support accurate alignment with compatible CPU and RAM BGA Pad layouts.
  6. Consistent Solder Paste Distribution: Fine aperture geometry helps distribute Solder Paste evenly across dense BGA patterns.
  7. Reduced Micro-Bridging: Controlled paste application and precise stencil alignment help reduce unwanted Solder Bridging during Reballing when used correctly.
  8. CPU Reballing Support: Suitable for preparing, Reballing, and reseating compatible Apple A10 Fusion processors during advanced repair procedures.
  9. Missing Pad Repair Support: Supports compatible Micro-Soldering workflows involving damaged or missing Pad areas under microscope inspection.
  10. Professional Microscope Repair: Ideal for CPU Reballing, RAM-related BGA work, Solder Paste application, Pad restoration support, and precision iPhone Logic Board servicing.


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MECHANIC iTin 04 A10 High-End BGA Steel Reballing Stencil for Apple A10 CPU
4.00JD 0.00JD
4.00JD
4