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MECHANIC IPX-11 Series Heating Module Platform with 5pcs Reballing Steel Stencils

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10.00JD

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Detail Description

  1. iPhone X-11 Series Heating Platform: Professional motherboard heating module designed for controlled layer separation, thermal splitting, and BGA Rework on compatible iPhone Logic Boards from iPhone X through iPhone 11 Pro Max.
  2. Double-Stacked PCB Support: Designed for compatible multi-layer Logic Boards requiring controlled heating during separation and rebuilding procedures.
  3. Uniform Heat Distribution: High-density thermal core architecture supports balanced heat transfer across the working area and helps reduce concentrated thermal stress.
  4. Controlled Layer Separation: Supports precise motherboard layer separation while helping reduce unwanted PCB deformation when used with proper repair techniques.
  5. 5 Reballing Steel Stencils: Includes five dedicated high-temperature-resistant steel stencils for compatible Reballing and motherboard repair applications.
  6. Precision Stencil Alignment: Accurately machined stencil layouts support controlled positioning over compatible motherboard Pad arrays under a microscope.
  7. Stable Component Positioning: The workstation structure helps reduce unwanted movement during Solder Paste application, alignment, and controlled thermal Rework.
  8. Heat-Resistant Steel Construction: Stencils are designed to maintain dimensional stability during repeated Reflow and BGA repair procedures.
  9. Cooling Structure: Integrated cooling layout supports controlled heat dissipation after thermal repair procedures.
  10. Professional Logic Board Repair: Suitable for Middle-Layer Separation, BGA Reballing, Solder Paste application, Pad repair support, and advanced multi-layer iPhone motherboard servicing.


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MECHANIC IPX-11 Series Heating Module Platform with 5pcs Reballing Steel Stencils
10.00JD 0.00JD
10.00JD
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