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MECHANIC IP14 Series Heating Module Platform with 2pcs Reballing Steel Stencils

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10.00JD

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  10.00JD

Detail Description

  1. iPhone 14 Series Heating Kit: Professional heating module and Reballing stencil set designed for compatible iPhone 14 series Logic Board repair.
  2. iPhone 14 Series Compatibility: Suitable for compatible iPhone 14, iPhone 14 Plus, iPhone 14 Pro, and iPhone 14 Pro Max motherboard workflows.
  3. Uniform PCB Heating: High-density thermal structure is designed to distribute heat evenly across supported double-stacked PCB areas.
  4. Layered Logic Board Separation: Supports controlled preheating and thermal separation during compatible multi-layer motherboard repair.
  5. Reduced Thermal Stress: Balanced heating helps reduce concentrated hot spots and unnecessary thermal stress that may contribute to PCB warping.
  6. 2 Reballing Steel Stencils: Includes two precision steel stencils designed for compatible BGA and motherboard Reballing procedures.
  7. Heat-Resistant Steel Construction: Stencils are designed to maintain stability during controlled soldering and Hot Air Rework.
  8. Precision Alignment: Accurate stencil positioning supports alignment with compatible Pads and component layouts during Solder Paste application.
  9. Pad Protection Support: Stable positioning and controlled heating help reduce excessive mechanical or thermal stress around delicate motherboard Pads when used correctly.
  10. Professional Micro-Soldering: Suitable for PCB Preheating, Logic Board separation, BGA Rework, Reballing, Solder Paste application, and advanced iPhone motherboard servicing.


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