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MECHANIC FX105 Ultra-Fine Non-Lacquer Copper Wire (100M)

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8.00JD

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  8.00JD

Detail Description

  1. Ultra-Fine Copper Jumper Wire: Professional repair wire designed for PCB trace restoration, broken pad reconstruction, and advanced Micro-Soldering.
  2. 0.02mm Ultra-Fine Diameter: Microscopic wire profile supports detailed routing through high-density PCB layouts, BGA areas, and compact CPU sections.
  3. 100-Meter Spool: Supplied as a 100M roll for repeated professional motherboard repair and circuit reconstruction work.
  4. High-Purity Copper Core: Copper construction provides reliable electrical conductivity for precision jumper-wire and trace-repair applications.
  5. Flexible Wire Structure: Fine construction supports controlled bending and routing around miniature components and narrow motherboard areas.
  6. Trace & Pad Reconstruction: Suitable for rebuilding damaged PCB traces and restoring compatible broken pad connections.
  7. BGA & CPU Repair Support: Fine diameter allows routing around or beneath compatible BGA packages and multi-layer CPU repair areas.
  8. Solderable Insulation Coating: Protective coating is designed to respond to soldering heat, reducing the need for extensive manual scraping before soldering.
  9. Reduced Bridging Risk: Insulated construction helps reduce unintended electrical contact between closely spaced conductors when routed and soldered correctly.
  10. Professional Micro-Soldering Use: Ideal for Jump Wire work, PCB trace restoration, BGA repair, CPU servicing, and detailed smartphone logic board maintenance.


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MECHANIC FX105 Ultra-Fine Non-Lacquer Copper Wire (100M)
8.00JD 0.00JD
8.00JD
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